Mijing A14 3D BGA Stencil IC Solder Reball Tin Plant Net for iPhone 12 Series

Price:
$9.78

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Description

1. This 3D stencil is easy to use no matter you are a new or expert.
2. High success rate of planting tin,the solder balls can be formed once after you are proficient.
3. This 3D planting stencil is thicker than ordinary stencils in the market .Less tendency of deformation makes its using life be longer.
4. The square holes design makes it easier to take out the formed solder balls.
5. Professional and practical, compact and portable.

Specification:
Package Weight
One Package Weight 0.05kgs / 0.11lb
Qty per Carton 240
Carton Weight 10.60kgs / 23.37lb
Carton Size 42cm * 38cm * 32cm / 16.54inch * 14.96inch * 12.6inch
Loading Container 20GP: 522 cartons * 240 pcs = 125280 pcs
40HQ: 1212 cartons * 240 pcs = 290880 pcs

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